BGA Assembly
We are very experienced in manufacturing PCBs with BGAs and routinely place more than 20,000off on a monthly basis.
The largest BGA we have fitted to date is 43mm² squared with 1074 balls. The finest pitch is 0.5mm.
BGA inspection is carried out using both visual and x-ray inspection tools. The level of inspection will depend upon a number of variables, including the batch size, the number of BGAs per PCB and the customer requirements.
As well as automatic placement of BGAs on a production basis we are also skilled in hand placing and reworking BGAs, including device re-balling. This work is carried out using an ERSA IR550 Rework Station
ERSA Scope
This revolutionary inspection system offers cross-sectional, non-destructive visual inspection of hidden solder joints by looking under the BGA. This will allow inspection of all types of BGA, Micro BGA and Flip Chip components, plus of course inspection of solder joints on more standard SMDs such as QFPs and PLCCs.
This allows the Surface texture of the solder ball, the formation of the solder ball and the solder fillet to be checked. This powerful inspection tool can also be used to inspect other aspects of a PCB and allows images to be saved and emailed to customers.
X-RAY
This 2 Axis bench top model provides an X-Ray inspection facility to supplement the ERSA cope providing a comprehensive BGA Inspection capability.